AMD has finally announced the release date and pricing for its highly anticipated 7000X3D processors. Gamers and enthusiasts alike will be able to purchase a Ryzen 9 7950X3D and Ryzen 9 7900X3D starting February 28th. Pricing is reasonable as well at $699 for the 7950X3D and $599 for the 7900X3D. AMD plans to follow up with the release of its 7800X3D on April 6th for a slightly more budget friendly $449.
Noctua has just announced its NA-TPG1 thermal paste guard for AMD’s new Ryzen 7000 series CPUs. Most of you know by now that there is quite a bit of concern over AMD’s new heat spreader design for the Ryzen 4 CPUs. The “cut-out” will undoubtedly become thermal paste troughs and make the cleaning of old paste from CPUs far more difficult. Noctua’s solution, the NA-TPG1, is a thin polycarbonate guard that helps to reduce the mess. Availability is expected in December and will be sold individually ($7.90), or bundled with the NT-H1 ($9.90) and NT-H2 ($13.90) AM5 Edition Thermal pastes. Below is Noctua’s press release.
AMD has announced a new naming scheme for its mobile processors for 2023 and beyond. Going forward AMD will utilize a number coding system that is simple and logical. Each of the four digits plus a trailing letter indicates its model year, market segment, architecture, feature isolation, and form factor (i.e. TDP). Below you will find AMD’s highly informative breakdown of how this works and why they decided it was time for a change.
Several days ago, we found out that under Windows 11 some applications and games performed a few percentage points slower on AMD CPUs. This slow down was because of an issue with L3 cache latency increasing significantly and AMD’s “preferred core” not always preferentially scheduling threads on a processor’s fastest core. Microsoft and AMD have been hard at work behind the scenes readying an update to restore the lost performance. That day is here.
For the last seven years, Silicon Lottery seeded the overclocking community with CPU binning and delidding services. As we here at Overclockers.com all know, achieving useful overclocks on Intel and AMD CPUs has become far less productive of late. Add in Intel’s use of soldered TIM rather than a polymer TIM for the past three generations, there just isn’t enough meat left on the bone for Silicon Lottery to help the community. So the owners have decided to shut down operations with the following statement…
Recently, an image of an Intel Z690 chipset was leaked by a member of the Chiphell forums. The Z690 will be the foundation for the next generation of Intel motherboards. It is significantly larger than the current Z590 chipset, but how that will affect its performance remains to be seen. Launch for these next-generation products are expected around November 19th, but that is not set in stone.
Today is launch day for AMD’s 3rd generation EPYC 7003 series server processors, the highest performance server processor with the EPYC 7763 being the flagship. In total there are 19 SKUs available filling a massive percentage of the server and datacenter market needs. Ranging from 8 core, 16 thread CPUs all the way up to 64 cores with 128 threads. All 7003 series EPYC processors will feature eight channels of 3200 Mhz RAM and PCIe4 x 128. Pricing for these workhorses ranges from $913 all the way up to $7890. This is what AMD says about the 3rd gen EPYC.
AMD has scheduled the digital launch of its 3rd Generation EPYC processors for March 15th, 2021. EPYC is AMD’s Server and Datacenter grade processor and is utilized for cloud management, database analytics, virtualization, and many other services. The 3rd Gen EPYC, code-named Milan, will be based on the Zen 3 architecture and feature up to 64 cores, 7nm process node, and 280W TDP.
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